ACTIVE & INTELLIGENT PACKAGING WORLD CONGRESS & HACKATHON

AIP World Congress & Exhibition is a 2-day event being held from 19th November to 20th November 2018 in Amsterdam, Netherlands. This event will bring together all the elements of Printed Electronics, Anti-Microbial, Nanotechnologies, Additives, Virtual & Augmented Reality and the Internet of Things (IoT).

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November

PACK EXPO International will be the biggest packaging and processing show on the planet, connecting more end users with more suppliers and more innovation than anywhere else you can imagine. 40+ vertical industries and 2500 exhibitors under one roof.