BDT Media Automation GmbH is contributing its expertise in B2 format feeders for digital printing.
Fujifilm Dimatix is adding its know-how in inkjet printheads for commercial and industrial printing.
And Phoseon Technology is bringing its finesse in in UV LED curing solutions for commercial and industrial applications.
These three companies are working together to develop a complete digital printing solution for packaging applications.
The system will take advantage of the flexibility of the BDT Tornado media handling technology and the versatility of UV printing provided by Fuji-Dimatix and Phoseon.
The Tornado-based Product Feeder (TPF) and Print-system will be able to perform off-line processing of standard packaging materials including coated and uncoated cardboard, corrugated board, and paper stock, as well as more exotic packing materials such as metallic foils and plastics. The solution will feed, align, print, cure and stack. And it will do all of this with minimal user intervention and greatly shortened job set up times.
“We are very pleased to be cooperating with Fuji Dimatix and Phoseon, two market leaders in their respective fields, to bring the TPF system to market. This development will bring the best of material handling and UV digital printing to package manufacturers. Our goal is to enable higher shop profitability by enabling our customers to achieve unprecedented packaging job flexibility,” Ralf Hipp, vice president of print media handling at BDT, stated.
"FujiFilm Dimatix is the world’s leading supplier of piezoelectric drop-on-demand ink jet products for industrial applications," said Howard Baldwin, vice president of Sales at FujiFilm. "The synergy of material handling, printing and LED curing together will deliver an optimal industrial solution for both end users and OEMs."
“The combination with Fuji Dimatix and BDT showcases how industry leaders can work together to [provide] customers higher productivity solutions with improved quality,” added Chad Taggard, vice president of Marketing at Phoseon.
The first demonstration of the solution will be at the Pack Expo International in Chicago, 2-5 November, 2014, BDT booth – E-9705 in Lakeside Lower Hall.
