Automation company Pilz will present sensor technology, control solutions and services aimed at improving the safety of packaging machines at interpack/components 2026 in Düsseldorf, taking place from 7–13 May.
At stand C11 in Hall 18b, the company will focus on solutions designed to maintain consistent machine performance under variable production conditions. Visitors will also be able to learn about services related to the EU Machinery Regulation (MR), which comes into force in 2027, the Cyber Resilience Act (CRA), and the EN 415 series of standards governing the safety of packaging machines.
Pilz will place particular emphasis on forming, filling and sealing (FFS) machines, demonstrating how certified, scalable and compatible safety solutions can be applied across different machine configurations and production processes.
The company said these safety solutions can help packaging machinery manufacturers implement current standards in packaging technology regardless of machine setup or process variability.
Another focus will be safety strategies for packaging machines in line with the MR and CRA, including steps to consider from development and design through to commissioning. Pilz will also present its services and training designed to support companies throughout the lifecycle of packaging machines.
Industrial security will also be addressed, including measures for the “protection of functional safety from cyber attacks”, “protection against unauthorised access” and “protection against on-site manipulation”.
Under the MR, machine manufacturers must carry out systematic risk assessments and consider digital risks throughout the machine lifecycle. To support this, Pilz will present its MYZEL Lifecycle Platform, which the company says provides a central platform to help ensure the legally compliant and safe operation of packaging machines, particularly FFS systems.
Pilz will also display its PSEN sensor technology portfolio, which is used to protect both packaging machines and operating personnel. The company will demonstrate how sensor-based safety and security can be implemented in packaging applications.
The stand will also include information on integrating intelligent diagnostic functions through the Pilz IO-Link Safety system, including what the company describes as the first certified IO-Link Safety Master, along with safety locking devices.
